L. B. Varela1, K. Tsoutas1, Y. Chatenet1, A. Miletić1, E. Brousser1, M. Mendez2, J. E. Klemberg-Sapieha1, L. Martinu1
1Department of Engineering Physics, Polytechnique Montréal, Montreal, QC H3T 1J4, Canada
2MDS Coating Technologies Corporation, Saint-Laurent H4S 1P4, Quebec, Canada
In this work, TiAlN thin films were grown by the Cathodic Arc Deposition (CAD) on Ti6Al4V and Inconel substrate, respectively. In addition, the TiAlN coatings were deposited by different biases and two substrates in order to evaluate their effect on the residual stress distribution through the thickness in the coatings. Structural characterization and residual stress measurements were performed by the grazing X-ray diffraction method and the data were collected at a Bruker Discover D8 (Cu tube X-ray source). Two rotations were chosen to assess the isotropy of residual stresses. Different angles of incidence were selected in order to obtain values of residual stress at different penetration depths. Results indicate higher tensile residual stress at the surface and smaller stresses at the film/substrate interface for the TiAlN thin films on both substrates. In addition, the residual stresses evaluated at the two rotations show slight variations, which suggests that the residual stress is not isotropic.