A. V. Kaziev, V. Yu. Lisenkov, A. V. Tumarkin, N. N. Samotaev, M. M. Kharkov

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute),31
Kashirskoe shosse, 115409 Moscow, Russia

We examined the feasibility of alumina substrate metallization by magnetron deposition of several-tens-µm copper coatings, as it may find applications in ceramic PCB production. The films were prepared in magnetron sputtering systems with cooled and thermally insulated (hot) targets. Substrates with different geometry were used. Thickness, adhesive properties, and electrical resistivity of produced coatings were analyzed. If the film thickness exceeded ~ 20 µm, we observed systematic delamination, unless the dedicated sub-layer of CuxOy was introduced between the substrate and the main Cu film. The adhesion was then scratch-tested for CuxOy + Cu coatings with total thickness ~ 40 µm. These coatings did not exhibit delamination in the whole range of exerted test force (20 N). The cooled- and hot-target magnetron sputtering approaches are compared in terms of film quality and deposition rate. The work was supported by the Russian Science Foundation (grant no. 18-79-10242).